Enhanced thermal and dielectric properties of heterogeneous copper oxide nanoparticles varied poly isoprene anti biofilm

Abstract

In order to improve the thermal and dielectric properties of poly isoprene (natural rubber), copper oxide (CuO) nanoparticles at low quantity have been varied by mechanical method. Copper oxide nanoparticles has synthesized by the simple chemical reaction between copper acetate and oxalic acid. 0.4 g of the prepared nanoparticles was impregnated into the isoprene. The structure of CuO and copper oxide nanoparticles varied poly isoprene were characterized, and the crystallite size, lattice strain, dislocation density and number of particles per unit volume were calculated. The result shows that compared with CuO nanoparticles, poly isoprene matrix with higher dislocation density confirms the hardest nature. The thermal analysis results show that copper oxide nanoparticles varied poly isoprene have much higher thermal stability. The thermal stability increases by adding lower quantity of copper oxide nanoparticles into the rubber matrix. Dielectric constant and dielectric loss of the materials are studied at different frequencies and temperature. Moreover, the dielectric properties also varied by the incorporation of copper oxide nanoparticles. The structure of CuO plays a significant synergetic effect in the reinforcing properties of poly isoprene. The outstanding antibacterial actions were also identified against Staphylococcus Aureus bacteria.